MRA4003T3G Series, NRVA4003T3G Series
http://onsemi.com
5
PACKAGE DIMENSIONS
SMA
CASE 403D?02
ISSUE G
4.0
0.157
2.0
0.0787
2.0
0.0787
mm
inches
SCALE 8:1
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.97 2.10 2.20 0.078
INCHES
A1
0.05 0.10 0.20 0.002
b
1.27 1.45 1.63 0.050
c
0.15 0.28 0.41 0.006
D
2.29 2.60 2.92 0.090
E
4.06 4.32 4.57 0.160
L
0.76 1.14 1.52 0.030
0.083 0.087
0.004 0.008
0.057 0.064
0.011 0.016
0.103 0.115
0.170 0.180
0.045 0.060
NOM MAX
4.83 5.21 5.59 0.190
0.205 0.220
HE
E
bD
L
c
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L.
POLARITY INDICATOROPTIONAL AS NEEDED
(SEE STYLES)
HE
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MRA4003T3/D
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